TiE Detroit and Kyyba Xcelerator have partnered to bring the mobility competition to TiECon Detroit, an annual conference for entrepreneurs, incubators, accelerators, and venture capital funds. The contest will take place from 2-3 p.m. Thursday, Nov. 9 at the Detroit Marriott at the GM Renaissance Center in Detroit.
Aimed at identifying the six top entrepreneurs and startups working on disruptive technologies in a variety of industries, the mobility competition will focus on mobility, autonomous transportation, electric vehicle technologies, connectivity technologies, Internet of Things (IOT), automotive, smart cities, and big data and machine learning. During the contest, the six finalists will compete before an audience of automotive executives, venture capitalists, angel investors, and Silicon Valley technologists.
Participants will have 10 minutes to pitch the judges and answer questions, with an additional two minutes for transition. The winner will be announced at 5 p.m. and will be eligible to receive $50,000 in investment, support services, and mentorship opportunities from Kyyba Xcelerator.
“The global automotive industry is undergoing an unprecedented transformation into a new mobility ecosystem. We are now on the cusp of a mobility revolution and the pace of change is breathtaking,” says Tel Ganesan, president of TiE Detroit. “I am looking forward to seeing what the participants have innovated or the ideas they plan to share that will help catalyze the future of mobility.”
TiECon Detroit is hosted by the Detroit chapter of the global non-profit organization for entrepreneurs and will run from Nov. 9-10 with the goal of bringing together TiE members, entrepreneurs, venture capitalists, industry executives, and thought leaders.
The conference will also feature TiE20, which will showcase the 20 most promising startup companies across IOT and sensors, financial technologies, transportation and mobility, healthcare, and manufacturing devices. Applications for the mobility competition are due by Oct. 22 and more information can be found here.