ESI Hosts Worldwide Forum on Smart Virtual Prototyping


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The Daimler EDM CAE Forum 2017 in Germany is a key meeting for the EDM and CAE communities worldwide.

Photo Courtesy: ESI Group

Farmington Hills-based ESI Group, a provider of virtual prototyping software and services for manufacturing industries, today announced it will hold multiple international ESI forums this summer and fall in North America, Germany, and Japan.

The events will be an opportunity to learn more about ESI’s software solutions, witness how customers benefit from smart virtual prototyping, and network with fellow users, worldwide industry experts, academics, and partners.

ESI’s North American forum will begin in Birmingham at the Townsend Hotel. The two-day conference from Sept. 26-27, along with workshops on Sept. 28, will bring clients from a diverse range of industries (ground transportation to aerospace and defense) together to exchange ideas on new trends in simulation and manufacturing and how to address the challenge of delivering more innovative and smarter products at a lower cost, faster, and with increased reliability.

The conference will combine ESI’s Casting User Group Meeting, OpenFOAM User Conference, VA User Group Meeting and all other ESI User Conferences into one all inclusive-forum.

Each day of the conference will begin at 9 a.m. and end around 5 p.m. with a Q&A session. The conference will feature talks from keynote speakers, technical sessions, and hands-on workshops covering the latest software updates for Casting and OpenFOAM.  

Tickets for the Sept. 26-27 conference are $250. Tickets for the Casting User Group Meeting-Conference and Hands-On Workshop Sept. 26-28 are $750. Tickets for the OpenFOAM User Group Meeting-Conference and Hands-On Workshop Sept. 26-28 are $750.

Training courses can be selected during the booking process. Coffee breaks and lunch are included in the registration fee. A special rate of $239 has been reserved at the Townsend Hotel for guests of the ESI Forum available until Sept. 5.

For more information on the conference, click here.

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